工艺制程能力

制程
Process
项目
Item
通常
Normal Capability
改进
Advanced capability
内层         Inner layer
内层线路
 Inner layer exposure
最小板厚(不含铜)
Min. board thickness (without Cu)
0.075mm
0.05mm
对位公差
Registration tolerance
+/-2mil
+/-1.5mil
内层铜厚
Inner copper thickness
2OZ
3OZ
线宽/线距
wire width/space
4/4mil
3/3mil
内层孔到线间距
 Inner layer hole to wire
4
4L
7mil
6mil
6
6L
8mil
7mil
8
8L
9mil
8mil
10层及以上
10L& above
10mil
9mil
压合
Lamination
最大层数
Max layer count
10L
12L
层间对准度
Layer to lay registration
+/-4mil
+/-3mil
铜箔厚度
Copper foil thickness
0.5OZ~3OZ
1/3OZ-3oz
介电层厚度公差
Dielectric layer thickness tolerance
±10%
±8%
钻孔
Drilling
最大钻孔孔径
Max. drilling size
6.0mm
6.5mm
最小钻孔孔径
Min drilling size
0.25mm
0.2mm
孔位精度公差
Drilling hole tolerance
+/-3mil
+/-2mil
NPTH 孔径公差
NPTH hole size tolerance
+0/-0.05mm
+0/-0.025mm
PTH 孔径公差(完成)
PTH hole size tolerance (finished)
+/-3mil
+/-2mil
孔壁粗糙度
Hole roughness
25µm
20µm
沉铜电镀
PTH
生产孔径(最小)
Hole size (Min)
0.25mm
0.2mm
纵横比(最大)
Aspect ratio(Max)
8:1
101
线路
Image transfer
外层最大铜厚
Max. Cu thickness
3OZ
4OZ
干膜最大封孔能力
Dry film tenting
4.5mm
6.0mm
对位公差
registration tolerance
+/-2mil
+/-1.5mil
线宽/线距 (底铜0.5OZ)
Wire Width/Space (base Cu 0.5OZ)
4/4mil (底铜0.5OZ)
3/3mil
阻焊
Solder mask
绿油桥最小宽度
Min. Solder bar 
4mil
3mil
绿油厚度
Soler mask thickness
线角≧7µm(line corner)
线面≧10µm (line surface)
线角≧7µm(line corner)
线面≧10µm (line surface)
对位公差
Registration tolerance
+/-2mil
+/-1.5mil
塞孔最大孔径
 Hole plugging size
0.45mm
0.55mm
SMT PAD之间最小距离
 Min. PAD space
7mil
6mil
字符
Legend
最小线宽线距
Min. line width/space
4mil/4mil
3.5mil/3.5mil
白字最小内径
Inner diameter of digital
8mil
7mil
碳油
Carbon ink
碳油方阻
 Rectangular resistance
40ohm
30ohm
印油PAD最小间距
Min carbon ink space
30mil
25mil
成型
Routing
锣板尺寸公差
Routing tolerance
+/-4mil
+/-3mil
最小锣刀
Min routing bit
0.8mm
0.7mm
槽位到锣边距离
routing slot to side
10mil(0.25mm)
8mil(0.2mm)
啤板
Punching
啤板尺寸公差
Punching tolerance
+/-4mil
+/-3mil
孔到边精度
hole to side
±5mil (0.125mm)
±4mil (0.1mm)
V-CUT
上、下V坑线对准度
Leveling of top/bottom V-cut line
±4mil (0.1mm)
± 3mil (0.075mm)
余厚控制精度
 web thickness
±4mil (0.1mm)
± 3mil (0.075mm)
V坑位置公差
V-Cut position
±4mil (0.1mm)
± 3mil (0.075mm)
电测试
E-testing
测试最小PAD
Min testing PAD
10mil
8mil
表面处理
Surface finish
OSP厚度
OSP film thickness
0.2-0.5µm
0.25-0.5µm
沉锡厚度
Immersion Tin thickness
0.8-1.2µm
1.0-1.2µm
沉银厚度
Immersion Ag thickness
0.1-0.3µm
0.2-0.3µm
化金厚度
Immersion Au thickness
1-2.5µ
1-2.5µ
沉镍厚度
Immersion Nick thickness
120-250µ
160-250µ
有铅喷锡厚度
HASL (Pb)
1-40µm
2-40µm
无铅喷锡厚度
HASL (Pb free)
1-40µm
2-40µm
其它能力
Other
阻抗控制
Impedance tolerance
±10%
±8%
板弯板曲
Board warpage/twist
0.75%
0.50%
内外层线宽公差
±20%
±15%
外层最大板尺寸
Max Board size
610x450mm
630x510mm
外层最小板尺寸
Min. board size
75*75mm
50*50mm
外层最大板厚
Max board thickness
2.5mm
3.2mm
外层最小板厚
Min board thickness
0.4mm
0.3mm